We are thrilled to announce that FiRa Consortium was highly impressed with our organization of the previous Test event, and have trusted us with the preparation of the upcoming gathering in Comarch HQ.
From May 29, global tech leaders will have the opportunity to participe in FiRa Test Event #9 in order to verify compatibility of their tools with applicable UWB standards and FiRa test specifications. It is a true privilege for us to once again welcome engineers from renowned industry leaders in UWB technology including NXP, Qorvo and Qualcomm.
Throughout this event, engineers will put their solutions to the test, utilizing the most up-to-date iterations of Comarch's test tools. This valuable opportunity allows us to gather valuable feedback on our devices, so we can continuously refine and improve them with an unwavering commitment to the highest quality of workmanship.